Paquete de gestión térmica optoelectrónica 4. ° Láseres de gas Módulo IGBT de chip de potencia montado en vehículo Mejor esparcidor de calor AlN
Atributos
ChinaLugar del origen
New FrontierMarca
AlN Chip Heat SpreaderNúmero de Modelo
Product NameTipo
MPCVD DiamondMaterial
Chipset Heat SpreaderTipo de montaje
Product name:AlN Heat Spreader
Advantages:High Quality -Preparation process; Low Cost Mass -Production Process
Features:High Thermal Conductivity Low Expansion Metal Matrix Composite
Keywords:Semiconductor Packaging Material
Core Technology:Large-scale, High-yield, Low-cost Industrial Mass Production Process
Function:Can replace the currently widely used Cu/W, Al/SiC others.
Thermal Conductivity:500-700 W m.K
Density:5.1-6.0 g cm3
Chemical Stability:Acid and alkali resistant
Dimensions:Customized
