





Atributos
ChinaLugar del origen
New FrontierMarca
AlN Chip Heat SpreaderNúmero de Modelo
Product NameTipo
MPCVD DiamondMaterial
Chipset Heat SpreaderTipo de montaje
Product name:AlN Heat Spreader
Advantages:High Quality -Preparation process; Low Cost Mass -Production Process
Features:High Thermal Conductivity Low Expansion Metal Matrix Composite
Keywords:Semiconductor Packaging Material
Core Technology:Large-scale, High-yield, Low-cost Industrial Mass Production Process
Function:Can replace the currently widely used Cu/W, Al/SiC others.
Thermal Conductivity:500-700 W m.K
Density:5.1-6.0 g cm3
Chemical Stability:Acid and alkali resistant
Dimensions:Customized

Paquete de gestión térmica optoelectrónica 4. ° Láseres de gas Módulo IGBT de chip de potencia montado en vehículo Mejor esparcidor de calor AlN
















