All categories

Featured selections

Trade Assurance

Buyer Central

Help Center

Get the app

Become a supplier

Cpu iphone 11 pro max

(41 productos disponibles)

Mijing-plataforma desoldadora en capas, placa base CH5 CH5-B CH5-C para <span class=keywords><strong>iPhone</strong></span> X XS 12pro <span class=keywords><strong>11</strong></span> <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, CHIP de <span class=keywords><strong>CPU</strong></span>, herramienta de eliminación de pegamento - Product Image 1

Mijing-plataforma desoldadora en capas, placa base CH5 CH5-B CH5-C para <span class=keywords><strong>iPhone</strong></span> X XS 12pro <span class=keywords><strong>11</strong></span> <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, CHIP de <span class=keywords><strong>CPU</strong></span>, herramienta de eliminación de pegamento - Product Image 2

Mijing-plataforma desoldadora en capas, placa base CH5 CH5-B CH5-C para <span class=keywords><strong>iPhone</strong></span> X XS 12pro <span class=keywords><strong>11</strong></span> <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, CHIP de <span class=keywords><strong>CPU</strong></span>, herramienta de eliminación de pegamento - Product Image 3

Mijing-plataforma desoldadora en capas, placa base CH5 CH5-B CH5-C para <span class=keywords><strong>iPhone</strong></span> X XS 12pro <span class=keywords><strong>11</strong></span> <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, CHIP de <span class=keywords><strong>CPU</strong></span>, herramienta de eliminación de pegamento - Product Image 4

Mijing-plataforma desoldadora en capas, placa base CH5 CH5-B CH5-C para <span class=keywords><strong>iPhone</strong></span> X XS 12pro <span class=keywords><strong>11</strong></span> <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, CHIP de <span class=keywords><strong>CPU</strong></span>, herramienta de eliminación de pegamento - Product Image 5

Mijing-plataforma desoldadora en capas, placa base CH5 CH5-B CH5-C para <span class=keywords><strong>iPhone</strong></span> X XS 12pro <span class=keywords><strong>11</strong></span> <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, CHIP de <span class=keywords><strong>CPU</strong></span>, herramienta de eliminación de pegamento - Product Image 6

Mijing-plataforma desoldadora en capas, placa base CH5 CH5-B CH5-C para iPhone X XS 12pro 11 Pro Max, CHIP de CPU, herramienta de eliminación de pegamento

EUR 110.23

MOQ: 10 unidades

Guangzhou Kusulong Electronic Co., Ltd.

6 yrs

CN

Para <span class=keywords><strong>iPhone</strong></span> <span class=keywords><strong>11</strong></span>, 12, 13, 13 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, 14 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, Versión Estadounidense, 8GB RAM, 48MP, 12MP, 6.1 Pulgadas, Red 5G - Product Image 1

Para <span class=keywords><strong>iPhone</strong></span> <span class=keywords><strong>11</strong></span>, 12, 13, 13 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, 14 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, Versión Estadounidense, 8GB RAM, 48MP, 12MP, 6.1 Pulgadas, Red 5G - Product Image 2

Para <span class=keywords><strong>iPhone</strong></span> <span class=keywords><strong>11</strong></span>, 12, 13, 13 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, 14 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, Versión Estadounidense, 8GB RAM, 48MP, 12MP, 6.1 Pulgadas, Red 5G - Product Image 3

Para <span class=keywords><strong>iPhone</strong></span> <span class=keywords><strong>11</strong></span>, 12, 13, 13 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, 14 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, Versión Estadounidense, 8GB RAM, 48MP, 12MP, 6.1 Pulgadas, Red 5G - Product Image 4

Para <span class=keywords><strong>iPhone</strong></span> <span class=keywords><strong>11</strong></span>, 12, 13, 13 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, 14 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, Versión Estadounidense, 8GB RAM, 48MP, 12MP, 6.1 Pulgadas, Red 5G - Product Image 5

Para <span class=keywords><strong>iPhone</strong></span> <span class=keywords><strong>11</strong></span>, 12, 13, 13 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, 14 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, Versión Estadounidense, 8GB RAM, 48MP, 12MP, 6.1 Pulgadas, Red 5G - Product Image 6

Para iPhone 11, 12, 13, 13 Pro Max, 14 Pro Max, Versión Estadounidense, 8GB RAM, 48MP, 12MP, 6.1 Pulgadas, Red 5G

EUR 164.69-172.01

MOQ: 5 docenas

Fuzhou Zhuoke Technology Co., Ltd.

1 yrs

CN

Módulo de molienda CNC JCID EM02 para <span class=keywords><strong>iPhone</strong></span> 6-16 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, placa base, disco de Hardware, <span class=keywords><strong>CPU</strong></span>, placa base táctil IC, reparación de pulido de Chip - Product Image 1

Módulo de molienda CNC JCID EM02 para <span class=keywords><strong>iPhone</strong></span> 6-16 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, placa base, disco de Hardware, <span class=keywords><strong>CPU</strong></span>, placa base táctil IC, reparación de pulido de Chip - Product Image 2

Módulo de molienda CNC JCID EM02 para <span class=keywords><strong>iPhone</strong></span> 6-16 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, placa base, disco de Hardware, <span class=keywords><strong>CPU</strong></span>, placa base táctil IC, reparación de pulido de Chip - Product Image 3

Módulo de molienda CNC JCID EM02 para <span class=keywords><strong>iPhone</strong></span> 6-16 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, placa base, disco de Hardware, <span class=keywords><strong>CPU</strong></span>, placa base táctil IC, reparación de pulido de Chip - Product Image 4

Módulo de molienda CNC JCID EM02 para <span class=keywords><strong>iPhone</strong></span> 6-16 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, placa base, disco de Hardware, <span class=keywords><strong>CPU</strong></span>, placa base táctil IC, reparación de pulido de Chip - Product Image 5

Módulo de molienda CNC JCID EM02 para <span class=keywords><strong>iPhone</strong></span> 6-16 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, placa base, disco de Hardware, <span class=keywords><strong>CPU</strong></span>, placa base táctil IC, reparación de pulido de Chip - Product Image 6

Módulo de molienda CNC JCID EM02 para iPhone 6-16 Pro Max, placa base, disco de Hardware, CPU, placa base táctil IC, reparación de pulido de Chip

EUR 39.69-92.60

MOQ: 1 unidad

Shenzhen Yinggelin International Technology Co., Ltd.

7 yrs

CN

Estación de plantillas de Reballing de <span class=keywords><strong>CPU</strong></span> de capa media QIANLI para <span class=keywords><strong>iPhone</strong></span> X XS <span class=keywords><strong>Max</strong></span> <span class=keywords><strong>11</strong></span> <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>11</strong></span> 12 13 14 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span> 12 Mini 14 Plus - Product Image 1

Estación de plantillas de Reballing de <span class=keywords><strong>CPU</strong></span> de capa media QIANLI para <span class=keywords><strong>iPhone</strong></span> X XS <span class=keywords><strong>Max</strong></span> <span class=keywords><strong>11</strong></span> <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>11</strong></span> 12 13 14 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span> 12 Mini 14 Plus - Product Image 2

Estación de plantillas de Reballing de <span class=keywords><strong>CPU</strong></span> de capa media QIANLI para <span class=keywords><strong>iPhone</strong></span> X XS <span class=keywords><strong>Max</strong></span> <span class=keywords><strong>11</strong></span> <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>11</strong></span> 12 13 14 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span> 12 Mini 14 Plus - Product Image 3

Estación de plantillas de Reballing de <span class=keywords><strong>CPU</strong></span> de capa media QIANLI para <span class=keywords><strong>iPhone</strong></span> X XS <span class=keywords><strong>Max</strong></span> <span class=keywords><strong>11</strong></span> <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>11</strong></span> 12 13 14 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span> 12 Mini 14 Plus - Product Image 4

Estación de plantillas de Reballing de <span class=keywords><strong>CPU</strong></span> de capa media QIANLI para <span class=keywords><strong>iPhone</strong></span> X XS <span class=keywords><strong>Max</strong></span> <span class=keywords><strong>11</strong></span> <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>11</strong></span> 12 13 14 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span> 12 Mini 14 Plus - Product Image 5

Estación de plantillas de Reballing de <span class=keywords><strong>CPU</strong></span> de capa media QIANLI para <span class=keywords><strong>iPhone</strong></span> X XS <span class=keywords><strong>Max</strong></span> <span class=keywords><strong>11</strong></span> <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>11</strong></span> 12 13 14 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span> 12 Mini 14 Plus - Product Image 6

Estación de plantillas de Reballing de CPU de capa media QIANLI para iPhone X XS Max 11 Pro 11 12 13 14 Pro Max 12 Mini 14 Plus

EUR 2.54-2.70

MOQ: 300 unidades

Shenzhen Born Eparts Co., Ltd.

3 yrs

CN

Módulo de Expansión de Estación de Precalentamiento MIJING IRepair MS1 para <span class=keywords><strong>iPhone</strong></span> X-14 <span class=keywords><strong>Pro</strong></span>/<span class=keywords><strong>Max</strong></span>, Android, Huawei, Mi, OPPO, Herramienta de Desoldadura - Product Image 1

Módulo de Expansión de Estación de Precalentamiento MIJING IRepair MS1 para <span class=keywords><strong>iPhone</strong></span> X-14 <span class=keywords><strong>Pro</strong></span>/<span class=keywords><strong>Max</strong></span>, Android, Huawei, Mi, OPPO, Herramienta de Desoldadura - Product Image 2

Módulo de Expansión de Estación de Precalentamiento MIJING IRepair MS1 para <span class=keywords><strong>iPhone</strong></span> X-14 <span class=keywords><strong>Pro</strong></span>/<span class=keywords><strong>Max</strong></span>, Android, Huawei, Mi, OPPO, Herramienta de Desoldadura - Product Image 3

Módulo de Expansión de Estación de Precalentamiento MIJING IRepair MS1 para <span class=keywords><strong>iPhone</strong></span> X-14 <span class=keywords><strong>Pro</strong></span>/<span class=keywords><strong>Max</strong></span>, Android, Huawei, Mi, OPPO, Herramienta de Desoldadura - Product Image 4

Módulo de Expansión de Estación de Precalentamiento MIJING IRepair MS1 para <span class=keywords><strong>iPhone</strong></span> X-14 <span class=keywords><strong>Pro</strong></span>/<span class=keywords><strong>Max</strong></span>, Android, Huawei, Mi, OPPO, Herramienta de Desoldadura - Product Image 5

Módulo de Expansión de Estación de Precalentamiento MIJING IRepair MS1 para <span class=keywords><strong>iPhone</strong></span> X-14 <span class=keywords><strong>Pro</strong></span>/<span class=keywords><strong>Max</strong></span>, Android, Huawei, Mi, OPPO, Herramienta de Desoldadura - Product Image 6

Módulo de Expansión de Estación de Precalentamiento MIJING IRepair MS1 para iPhone X-14 Pro/Max, Android, Huawei, Mi, OPPO, Herramienta de Desoldadura

EUR 6.16

MOQ: 1 unidad

Shenzhen Jueyue Technology Co., Limited

14 yrs

CN

Plantilla de reparación Qianli BGA para <span class=keywords><strong>iPhone</strong></span> 13 12 <span class=keywords><strong>11</strong></span> <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span> XS XR X 8 7 6S 6 IC Chip <span class=keywords><strong>CPU</strong></span> Plantilla de soldadura de plantación de estaño - Product Image 1

Plantilla de reparación Qianli BGA para <span class=keywords><strong>iPhone</strong></span> 13 12 <span class=keywords><strong>11</strong></span> <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span> XS XR X 8 7 6S 6 IC Chip <span class=keywords><strong>CPU</strong></span> Plantilla de soldadura de plantación de estaño - Product Image 2

Plantilla de reparación Qianli BGA para <span class=keywords><strong>iPhone</strong></span> 13 12 <span class=keywords><strong>11</strong></span> <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span> XS XR X 8 7 6S 6 IC Chip <span class=keywords><strong>CPU</strong></span> Plantilla de soldadura de plantación de estaño - Product Image 3

Plantilla de reparación Qianli BGA para <span class=keywords><strong>iPhone</strong></span> 13 12 <span class=keywords><strong>11</strong></span> <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span> XS XR X 8 7 6S 6 IC Chip <span class=keywords><strong>CPU</strong></span> Plantilla de soldadura de plantación de estaño - Product Image 4

Plantilla de reparación Qianli BGA para <span class=keywords><strong>iPhone</strong></span> 13 12 <span class=keywords><strong>11</strong></span> <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span> XS XR X 8 7 6S 6 IC Chip <span class=keywords><strong>CPU</strong></span> Plantilla de soldadura de plantación de estaño - Product Image 5

Plantilla de reparación Qianli BGA para <span class=keywords><strong>iPhone</strong></span> 13 12 <span class=keywords><strong>11</strong></span> <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span> XS XR X 8 7 6S 6 IC Chip <span class=keywords><strong>CPU</strong></span> Plantilla de soldadura de plantación de estaño - Product Image 6

Plantilla de reparación Qianli BGA para iPhone 13 12 11 Pro Max XS XR X 8 7 6S 6 IC Chip CPU Plantilla de soldadura de plantación de estaño

EUR 20.29

MOQ: 2 unidades

Citee Industrial Co., Ltd

3 yrs

CN

Placa base IC Chip Mini accesorio giratorio RELIFE abrazadera Universal de resistencia al calor teléfono PCB <span class=keywords><strong>CPU</strong></span> Disco Duro BGA Jig Board herramienta - Product Image 1

Placa base IC Chip Mini accesorio giratorio RELIFE abrazadera Universal de resistencia al calor teléfono PCB <span class=keywords><strong>CPU</strong></span> Disco Duro BGA Jig Board herramienta - Product Image 2

Placa base IC Chip Mini accesorio giratorio RELIFE abrazadera Universal de resistencia al calor teléfono PCB <span class=keywords><strong>CPU</strong></span> Disco Duro BGA Jig Board herramienta - Product Image 3

Placa base IC Chip Mini accesorio giratorio RELIFE abrazadera Universal de resistencia al calor teléfono PCB <span class=keywords><strong>CPU</strong></span> Disco Duro BGA Jig Board herramienta - Product Image 4

Placa base IC Chip Mini accesorio giratorio RELIFE abrazadera Universal de resistencia al calor teléfono PCB <span class=keywords><strong>CPU</strong></span> Disco Duro BGA Jig Board herramienta - Product Image 5

Placa base IC Chip Mini accesorio giratorio RELIFE abrazadera Universal de resistencia al calor teléfono PCB <span class=keywords><strong>CPU</strong></span> Disco Duro BGA Jig Board herramienta - Product Image 6

Placa base IC Chip Mini accesorio giratorio RELIFE abrazadera Universal de resistencia al calor teléfono PCB CPU Disco Duro BGA Jig Board herramienta

EUR 10.57-11.19

MOQ: 1 unidad

Shenzhen Kingmax Technology Co., Ltd.

4 yrs

CN

Plantilla de Reballing BGA RELIFE para <span class=keywords><strong>iPhone</strong></span> Series 6-16PM, Malla de Acero para Plantación de Estaño, Herramientas de Reparación de Teléfonos Móviles - Product Image 1

Plantilla de Reballing BGA RELIFE para <span class=keywords><strong>iPhone</strong></span> Series 6-16PM, Malla de Acero para Plantación de Estaño, Herramientas de Reparación de Teléfonos Móviles - Product Image 2

Plantilla de Reballing BGA RELIFE para <span class=keywords><strong>iPhone</strong></span> Series 6-16PM, Malla de Acero para Plantación de Estaño, Herramientas de Reparación de Teléfonos Móviles - Product Image 3

Plantilla de Reballing BGA RELIFE para <span class=keywords><strong>iPhone</strong></span> Series 6-16PM, Malla de Acero para Plantación de Estaño, Herramientas de Reparación de Teléfonos Móviles - Product Image 4

Plantilla de Reballing BGA RELIFE para <span class=keywords><strong>iPhone</strong></span> Series 6-16PM, Malla de Acero para Plantación de Estaño, Herramientas de Reparación de Teléfonos Móviles - Product Image 5

Plantilla de Reballing BGA RELIFE para <span class=keywords><strong>iPhone</strong></span> Series 6-16PM, Malla de Acero para Plantación de Estaño, Herramientas de Reparación de Teléfonos Móviles - Product Image 6

Plantilla de Reballing BGA RELIFE para iPhone Series 6-16PM, Malla de Acero para Plantación de Estaño, Herramientas de Reparación de Teléfonos Móviles

EUR 0.9524

MOQ: 20 paquetes

Shenzhen Bailishen Technology Co., Ltd.

1 yrs

CN