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Cpu iphone 11 pro max

(48 productos disponibles)

Mijing-plataforma desoldadora en capas, placa base CH5 CH5-B CH5-C para <span class=keywords><strong>iPhone</strong></span> X XS 12pro <span class=keywords><strong>11</strong></span> <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, CHIP de <span class=keywords><strong>CPU</strong></span>, herramienta de eliminación de pegamento - Product Image 1

Mijing-plataforma desoldadora en capas, placa base CH5 CH5-B CH5-C para <span class=keywords><strong>iPhone</strong></span> X XS 12pro <span class=keywords><strong>11</strong></span> <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, CHIP de <span class=keywords><strong>CPU</strong></span>, herramienta de eliminación de pegamento - Product Image 2

Mijing-plataforma desoldadora en capas, placa base CH5 CH5-B CH5-C para <span class=keywords><strong>iPhone</strong></span> X XS 12pro <span class=keywords><strong>11</strong></span> <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, CHIP de <span class=keywords><strong>CPU</strong></span>, herramienta de eliminación de pegamento - Product Image 3

Mijing-plataforma desoldadora en capas, placa base CH5 CH5-B CH5-C para <span class=keywords><strong>iPhone</strong></span> X XS 12pro <span class=keywords><strong>11</strong></span> <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, CHIP de <span class=keywords><strong>CPU</strong></span>, herramienta de eliminación de pegamento - Product Image 4

Mijing-plataforma desoldadora en capas, placa base CH5 CH5-B CH5-C para <span class=keywords><strong>iPhone</strong></span> X XS 12pro <span class=keywords><strong>11</strong></span> <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, CHIP de <span class=keywords><strong>CPU</strong></span>, herramienta de eliminación de pegamento - Product Image 5

Mijing-plataforma desoldadora en capas, placa base CH5 CH5-B CH5-C para <span class=keywords><strong>iPhone</strong></span> X XS 12pro <span class=keywords><strong>11</strong></span> <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, CHIP de <span class=keywords><strong>CPU</strong></span>, herramienta de eliminación de pegamento - Product Image 6

Mijing-plataforma desoldadora en capas, placa base CH5 CH5-B CH5-C para iPhone X XS 12pro 11 Pro Max, CHIP de CPU, herramienta de eliminación de pegamento

EUR 109.53

MOQ: 10 unidades

Guangzhou Kusulong Electronic Co., Ltd.

6 yrs

CN

Para <span class=keywords><strong>iPhone</strong></span> <span class=keywords><strong>11</strong></span>, 12, 13, 13 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, 14 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, Versión Estadounidense, 8GB RAM, 48MP, 12MP, 6.1 Pulgadas, Red 5G - Product Image 1

Para <span class=keywords><strong>iPhone</strong></span> <span class=keywords><strong>11</strong></span>, 12, 13, 13 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, 14 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, Versión Estadounidense, 8GB RAM, 48MP, 12MP, 6.1 Pulgadas, Red 5G - Product Image 2

Para <span class=keywords><strong>iPhone</strong></span> <span class=keywords><strong>11</strong></span>, 12, 13, 13 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, 14 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, Versión Estadounidense, 8GB RAM, 48MP, 12MP, 6.1 Pulgadas, Red 5G - Product Image 3

Para <span class=keywords><strong>iPhone</strong></span> <span class=keywords><strong>11</strong></span>, 12, 13, 13 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, 14 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, Versión Estadounidense, 8GB RAM, 48MP, 12MP, 6.1 Pulgadas, Red 5G - Product Image 4

Para <span class=keywords><strong>iPhone</strong></span> <span class=keywords><strong>11</strong></span>, 12, 13, 13 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, 14 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, Versión Estadounidense, 8GB RAM, 48MP, 12MP, 6.1 Pulgadas, Red 5G - Product Image 5

Para <span class=keywords><strong>iPhone</strong></span> <span class=keywords><strong>11</strong></span>, 12, 13, 13 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, 14 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, Versión Estadounidense, 8GB RAM, 48MP, 12MP, 6.1 Pulgadas, Red 5G - Product Image 6

Para iPhone 11, 12, 13, 13 Pro Max, 14 Pro Max, Versión Estadounidense, 8GB RAM, 48MP, 12MP, 6.1 Pulgadas, Red 5G

EUR 163.63-170.90

MOQ: 5 docenas

Fuzhou Zhuoke Technology Co., Ltd.

1 yrs

CN

Placa base de donación para <span class=keywords><strong>iPhone</strong></span> X XR XS <span class=keywords><strong>11</strong></span> 12 13 14 15 16 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, Placa lógica sin NAND, para práctica de reparación de <span class=keywords><strong>CPU</strong></span> y extracción de IC de alimentación - Product Image 1

Placa base de donación para <span class=keywords><strong>iPhone</strong></span> X XR XS <span class=keywords><strong>11</strong></span> 12 13 14 15 16 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, Placa lógica sin NAND, para práctica de reparación de <span class=keywords><strong>CPU</strong></span> y extracción de IC de alimentación - Product Image 2

Placa base de donación para <span class=keywords><strong>iPhone</strong></span> X XR XS <span class=keywords><strong>11</strong></span> 12 13 14 15 16 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, Placa lógica sin NAND, para práctica de reparación de <span class=keywords><strong>CPU</strong></span> y extracción de IC de alimentación - Product Image 3

Placa base de donación para <span class=keywords><strong>iPhone</strong></span> X XR XS <span class=keywords><strong>11</strong></span> 12 13 14 15 16 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, Placa lógica sin NAND, para práctica de reparación de <span class=keywords><strong>CPU</strong></span> y extracción de IC de alimentación - Product Image 4

Placa base de donación para <span class=keywords><strong>iPhone</strong></span> X XR XS <span class=keywords><strong>11</strong></span> 12 13 14 15 16 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, Placa lógica sin NAND, para práctica de reparación de <span class=keywords><strong>CPU</strong></span> y extracción de IC de alimentación - Product Image 5

Placa base de donación para <span class=keywords><strong>iPhone</strong></span> X XR XS <span class=keywords><strong>11</strong></span> 12 13 14 15 16 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, Placa lógica sin NAND, para práctica de reparación de <span class=keywords><strong>CPU</strong></span> y extracción de IC de alimentación - Product Image 6

Placa base de donación para iPhone X XR XS 11 12 13 14 15 16 Pro Max, Placa lógica sin NAND, para práctica de reparación de CPU y extracción de IC de alimentación

EUR 1.37-35.49

MOQ: 10 unidades

Shenzhen Bailishen Technology Co., Ltd.

1 yrs

CN

Módulo de molienda CNC JCID EM02 para <span class=keywords><strong>iPhone</strong></span> 6-16 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, placa base, disco de Hardware, <span class=keywords><strong>CPU</strong></span>, placa base táctil IC, reparación de pulido de Chip - Product Image 1

Módulo de molienda CNC JCID EM02 para <span class=keywords><strong>iPhone</strong></span> 6-16 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, placa base, disco de Hardware, <span class=keywords><strong>CPU</strong></span>, placa base táctil IC, reparación de pulido de Chip - Product Image 2

Módulo de molienda CNC JCID EM02 para <span class=keywords><strong>iPhone</strong></span> 6-16 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, placa base, disco de Hardware, <span class=keywords><strong>CPU</strong></span>, placa base táctil IC, reparación de pulido de Chip - Product Image 3

Módulo de molienda CNC JCID EM02 para <span class=keywords><strong>iPhone</strong></span> 6-16 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, placa base, disco de Hardware, <span class=keywords><strong>CPU</strong></span>, placa base táctil IC, reparación de pulido de Chip - Product Image 4

Módulo de molienda CNC JCID EM02 para <span class=keywords><strong>iPhone</strong></span> 6-16 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, placa base, disco de Hardware, <span class=keywords><strong>CPU</strong></span>, placa base táctil IC, reparación de pulido de Chip - Product Image 5

Módulo de molienda CNC JCID EM02 para <span class=keywords><strong>iPhone</strong></span> 6-16 <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span>, placa base, disco de Hardware, <span class=keywords><strong>CPU</strong></span>, placa base táctil IC, reparación de pulido de Chip - Product Image 6

Módulo de molienda CNC JCID EM02 para iPhone 6-16 Pro Max, placa base, disco de Hardware, CPU, placa base táctil IC, reparación de pulido de Chip

EUR 39.43-92

MOQ: 1 unidad

Shenzhen Yinggelin International Technology Co., Ltd.

8 yrs

CN

Estación de Precalentamiento y Desoldadura iParts Xinzhizao XZZ L2023 para Reparación de Chips de Placa Base y Matriz de Puntos de <span class=keywords><strong>iPhone</strong></span> X-15PM y Android - Product Image 1

Estación de Precalentamiento y Desoldadura iParts Xinzhizao XZZ L2023 para Reparación de Chips de Placa Base y Matriz de Puntos de <span class=keywords><strong>iPhone</strong></span> X-15PM y Android - Product Image 2

Estación de Precalentamiento y Desoldadura iParts Xinzhizao XZZ L2023 para Reparación de Chips de Placa Base y Matriz de Puntos de <span class=keywords><strong>iPhone</strong></span> X-15PM y Android - Product Image 3

Estación de Precalentamiento y Desoldadura iParts Xinzhizao XZZ L2023 para Reparación de Chips de Placa Base y Matriz de Puntos de <span class=keywords><strong>iPhone</strong></span> X-15PM y Android - Product Image 4

Estación de Precalentamiento y Desoldadura iParts Xinzhizao XZZ L2023 para Reparación de Chips de Placa Base y Matriz de Puntos de <span class=keywords><strong>iPhone</strong></span> X-15PM y Android - Product Image 5

Estación de Precalentamiento y Desoldadura iParts Xinzhizao XZZ L2023 para Reparación de Chips de Placa Base y Matriz de Puntos de iPhone X-15PM y Android

EUR 83.24

MOQ: 1 conjunto

Shenzhen Iparts Electronic Co., Ltd.

12 yrs

CN

Plantilla de reparación Qianli BGA para <span class=keywords><strong>iPhone</strong></span> 13 12 <span class=keywords><strong>11</strong></span> <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span> XS XR X 8 7 6S 6 IC Chip <span class=keywords><strong>CPU</strong></span> Plantilla de soldadura de plantación de estaño - Product Image 1

Plantilla de reparación Qianli BGA para <span class=keywords><strong>iPhone</strong></span> 13 12 <span class=keywords><strong>11</strong></span> <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span> XS XR X 8 7 6S 6 IC Chip <span class=keywords><strong>CPU</strong></span> Plantilla de soldadura de plantación de estaño - Product Image 2

Plantilla de reparación Qianli BGA para <span class=keywords><strong>iPhone</strong></span> 13 12 <span class=keywords><strong>11</strong></span> <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span> XS XR X 8 7 6S 6 IC Chip <span class=keywords><strong>CPU</strong></span> Plantilla de soldadura de plantación de estaño - Product Image 3

Plantilla de reparación Qianli BGA para <span class=keywords><strong>iPhone</strong></span> 13 12 <span class=keywords><strong>11</strong></span> <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span> XS XR X 8 7 6S 6 IC Chip <span class=keywords><strong>CPU</strong></span> Plantilla de soldadura de plantación de estaño - Product Image 4

Plantilla de reparación Qianli BGA para <span class=keywords><strong>iPhone</strong></span> 13 12 <span class=keywords><strong>11</strong></span> <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span> XS XR X 8 7 6S 6 IC Chip <span class=keywords><strong>CPU</strong></span> Plantilla de soldadura de plantación de estaño - Product Image 5

Plantilla de reparación Qianli BGA para <span class=keywords><strong>iPhone</strong></span> 13 12 <span class=keywords><strong>11</strong></span> <span class=keywords><strong>Pro</strong></span> <span class=keywords><strong>Max</strong></span> XS XR X 8 7 6S 6 IC Chip <span class=keywords><strong>CPU</strong></span> Plantilla de soldadura de plantación de estaño - Product Image 6

Plantilla de reparación Qianli BGA para iPhone 13 12 11 Pro Max XS XR X 8 7 6S 6 IC Chip CPU Plantilla de soldadura de plantación de estaño

EUR 20.16

MOQ: 2 unidades

Citee Industrial Co., Ltd

3 yrs

CN

Herramienta de reparación de placa base de capa media Amaoe, plantilla de reparación de <span class=keywords><strong>CPU</strong></span> BGA de malla de estaño de acero para iP 6/7/8/X/XS/<span class=keywords><strong>11</strong></span>/12/13/14/S/P/PM/Mini - Product Image 1

Herramienta de reparación de placa base de capa media Amaoe, plantilla de reparación de <span class=keywords><strong>CPU</strong></span> BGA de malla de estaño de acero para iP 6/7/8/X/XS/<span class=keywords><strong>11</strong></span>/12/13/14/S/P/PM/Mini - Product Image 2

Herramienta de reparación de placa base de capa media Amaoe, plantilla de reparación de <span class=keywords><strong>CPU</strong></span> BGA de malla de estaño de acero para iP 6/7/8/X/XS/<span class=keywords><strong>11</strong></span>/12/13/14/S/P/PM/Mini - Product Image 3

Herramienta de reparación de placa base de capa media Amaoe, plantilla de reparación de <span class=keywords><strong>CPU</strong></span> BGA de malla de estaño de acero para iP 6/7/8/X/XS/<span class=keywords><strong>11</strong></span>/12/13/14/S/P/PM/Mini - Product Image 4

Herramienta de reparación de placa base de capa media Amaoe, plantilla de reparación de <span class=keywords><strong>CPU</strong></span> BGA de malla de estaño de acero para iP 6/7/8/X/XS/<span class=keywords><strong>11</strong></span>/12/13/14/S/P/PM/Mini - Product Image 5

Herramienta de reparación de placa base de capa media Amaoe, plantilla de reparación de <span class=keywords><strong>CPU</strong></span> BGA de malla de estaño de acero para iP 6/7/8/X/XS/<span class=keywords><strong>11</strong></span>/12/13/14/S/P/PM/Mini - Product Image 6

Herramienta de reparación de placa base de capa media Amaoe, plantilla de reparación de CPU BGA de malla de estaño de acero para iP 6/7/8/X/XS/11/12/13/14/S/P/PM/Mini

EUR 1.05-1.54

MOQ: 2 unidades

Shenzhen Huimin Tong Accessories Co., Ltd.

5 yrs

CN

Plantilla de Reballing de Acero QIANLI para <span class=keywords><strong>iPhone</strong></span> <span class=keywords><strong>11</strong></span> 13 <span class=keywords><strong>Pro</strong></span> XS <span class=keywords><strong>MAX</strong></span> XR X 8P 8 7P 7 6S 6plus <span class=keywords><strong>CPU</strong></span> IC Chip Planting Teléfonos Móviles - Product Image 1

Plantilla de Reballing de Acero QIANLI para <span class=keywords><strong>iPhone</strong></span> <span class=keywords><strong>11</strong></span> 13 <span class=keywords><strong>Pro</strong></span> XS <span class=keywords><strong>MAX</strong></span> XR X 8P 8 7P 7 6S 6plus <span class=keywords><strong>CPU</strong></span> IC Chip Planting Teléfonos Móviles - Product Image 2

Plantilla de Reballing de Acero QIANLI para <span class=keywords><strong>iPhone</strong></span> <span class=keywords><strong>11</strong></span> 13 <span class=keywords><strong>Pro</strong></span> XS <span class=keywords><strong>MAX</strong></span> XR X 8P 8 7P 7 6S 6plus <span class=keywords><strong>CPU</strong></span> IC Chip Planting Teléfonos Móviles - Product Image 3

Plantilla de Reballing de Acero QIANLI para <span class=keywords><strong>iPhone</strong></span> <span class=keywords><strong>11</strong></span> 13 <span class=keywords><strong>Pro</strong></span> XS <span class=keywords><strong>MAX</strong></span> XR X 8P 8 7P 7 6S 6plus <span class=keywords><strong>CPU</strong></span> IC Chip Planting Teléfonos Móviles - Product Image 4

Plantilla de Reballing de Acero QIANLI para <span class=keywords><strong>iPhone</strong></span> <span class=keywords><strong>11</strong></span> 13 <span class=keywords><strong>Pro</strong></span> XS <span class=keywords><strong>MAX</strong></span> XR X 8P 8 7P 7 6S 6plus <span class=keywords><strong>CPU</strong></span> IC Chip Planting Teléfonos Móviles - Product Image 5

Plantilla de Reballing de Acero QIANLI para <span class=keywords><strong>iPhone</strong></span> <span class=keywords><strong>11</strong></span> 13 <span class=keywords><strong>Pro</strong></span> XS <span class=keywords><strong>MAX</strong></span> XR X 8P 8 7P 7 6S 6plus <span class=keywords><strong>CPU</strong></span> IC Chip Planting Teléfonos Móviles - Product Image 6

Plantilla de Reballing de Acero QIANLI para iPhone 11 13 Pro XS MAX XR X 8P 8 7P 7 6S 6plus CPU IC Chip Planting Teléfonos Móviles

EUR 2.85-3.64

MOQ: 1 unidad

Shenzhen Hodaxin International Trade Co., Ltd.

7 yrs

CN